Depozicija atomskih slojeva (ALD)
ALD (Atomic Layer Deposition) is a deposition process that allows for the vacuum deposition of thin films of material using gaseous precursors.
The parts to be treated are placed in a vacuum machine.
After introducing precursor A, which deposits on the entire surface of the parts, precursor B is introduced and reacts with the initially deposited atoms to form the first atomic layer.
This cycle is repeated until the desired thickness is achieved.
The deposition temperature ranges from 150 to 200°.
Advantages
Perfect conformability
Excellent homogeneity on 3D parts
Reproducibility of the coating
Control of thickness at the nanometer scale
Good chemical stability
Excellent barrier layer
Non-polluting technology